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The world’s first MediaTek Dimensity 9000+ smartphone is presented without holes in the screen and with a folding back panel – Asus ROG 6 Dimensity Supreme Edition

Today, Asis held a global press conference and officially unveiled the new generation of ROG Phone 6D esports mobile phone, which is called Asus ROG 6 Dimensity Supreme Edition.

One of the main features of the phone is that it was the first smartphone to be equipped with the flagship MediaTek Dimensity 9000+ single-chip system. The Asis ROG 6 Dimensity Extreme Edition uses a full-screen 6.78-inch screen with a resolution of 2448 x 1080 pixels. It is also the first smartphone based on the Dimensity 9000+ with a hole-free screen.

The phone has a 12-megapixel front camera, and the main camera has image sensors with a resolution of 50, 13 and 5 megapixels. The battery capacity is 6000mAh and supports 65W wired charging.

Asus ROG 6 Dimensity Supreme Edition is equipped with 16 GB of RAM and at least 256 GB of flash memory. It weighs 239g, has a body thickness of 10.4mm, and is rated IPX4.

In terms of heat dissipation, Asis ROG 6 Dimensity Extreme Edition has a system that allows you to open part of the lid for excellent cooling, the efficiency of which is increased by 20%. The hinged part is called the AeroActive Portal, and if it falls out of your hands, it will automatically close to prevent damage.

The world's first MediaTek Dimensity 9000+ smartphone is presented without holes in the screen and with a folding back panel - Asus ROG 6 Dimensity Supreme Edition

The starting price of this novelty in the UK is 800 pounds.

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