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The last secret of the “lightweight” PlayStation 5. The console received an updated AMD Oberon Plus platform

Insiders have revealed the last secret of the “lite” version of the PlayStation 5 game console with catalog number CFI-1200 / CFI-1202. As it turned out, it uses the new AMD Oberon Plus single-chip system, which has an important difference from the previous one.

We have already talked about the CFI-1200 in detail: the console is lighter than previous versions, received a modified layout inside and a more compact cooling system. As it turned out, this is not all innovations: the device uses the AMD Oberon Plus SoC, made using a 6-nanometer process technology.

On paper, the transition from a 7nm SoC to a 6nm one does not look like something impressive, but in fact, this is what allowed the set-top box to be lighter and reduce heat. Switching to N6 technology can increase transistor density by almost 20% while reducing power consumption. If the SoC heats up less, then it does not need a large cooling system. That is why the “lightweight” PS5 has a more compact heatsink.

The last secret of the “lightweight” PlayStation 5. The console received an updated AMD Oberon Plus platform
Oberon Plus – left, Oberon – right

The image above clearly demonstrates how AMD’s 6nm Oberon Plus SoC differs from the 7nm Oberon. Oberon Plus crystal area is 260mm2 – Approximately 15% less Oberon crystal area (300 mm2). There is another benefit of moving to a thinner manufacturing process – more chips fit on the substrate. And this is, at the same time, a reduction in the cost of chips, and an increase in output. The latter circumstance will help Sony reduce the shortage of consoles in the market.

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