New information has appeared on the network about the Xiaomi Mix Flip clamshell, which has not yet been announced by the manufacturer. In addition to the schematic rendering, insiders published the estimated characteristics of the cameras of the future new product.
According to the Android Headlines portal, the gadget will receive a Snapdragon 8 Gen 3 processor and a small external screen, next to which will be a dual main camera module. The characteristics of the cameras of the future new product were also discovered in the HyperOS code:
- Main sensor: OVX8000 (Light Hunter 800, 50 MP, 1/1.55″)
- Secondary sensor: OV60A40 (60 MP, 9152 x 6592, 1/2.80″, 0.61 µm), telephoto lens x2 optical zoom
- Front: OmniVision OV32B40 (32 MP, 1/3″, 0.7 micron)
In addition, the source attributes the gadgets to a main display with a resolution of 1.5K. Finally, the portal hinted at the release date of the flip phone. If we consider the article number 2405 CPX3DG , which appears in the firmware, to be reliable, the new product may be shown as early as next month.