Samsung is preparing to launch DDR6 memory modules on the market. Sources say the South Korean tech giant is planning to introduce modified Semi-Additive Process (mSAP) packaging technology to produce DDR6 chips.
According to Samsung Vice President Yangwang Koh, packaging technology should evolve with memory modules as they become more powerful. Applying the mSAP process to DDR6 memory chips will allow Samsung to create more advanced chips. He clarified that Samsung’s competitors have already used the mSAP process for DDR5 memory, and Samsung is reportedly working on using this packaging technology for DDR6.
Recall the South Korean tech giant last week introduced its first GDDR6 memory chips with 24Gb/s processing speed, that is, at a frequency of 24 GHz. At the same time, the company continues to work on DDR6 (not to be confused with GDDR6). According to available data, the development of DDR6 can be completed by 2024.
DDR6 is expected to be twice as fast and have twice as many memory channels as DDR5. DDR6 will be able to achieve transfer rates of around 12,800 Mbps on JEDEC modules, or 17,000 Mbps when overclocked.
Earlier last year, Samsung announced the world’s first 512GB DDR5-7200 memory that delivers 40% faster performance than DDR4 solutions.