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HomeDigit NewsPreparing for Wi-Fi 7: Qualcomm, Broadcom, Intel develop 6nm wireless chips

Preparing for Wi-Fi 7: Qualcomm, Broadcom, Intel develop 6nm wireless chips

Although MediaTek announcedthat its Wi-Fi 7 solutions will be launched early next year, the industry expects the actual implementation period of this wireless standard to be in 2023-2024.

To this end, leading wireless solution vendors such as Qualcomm, Broadcom and Intel are accelerating the development of chips for Wi-Fi 7-enabled devices. A significant portion of them will be based on TSMC’s 6nm process.

Wi-Fi 7 (IEEE 802.11be) will bring technologies such as 320 MHz bandwidth, 4096-QAM, multi-channel operation, improved MU-MIMO, and multi-AP collaboration to make Wi-Fi 7 better than Wi -Fi 6, provide faster data transfer rate and lower latency.

In terms of speed, Wi-Fi 7 is expected to support up to 30Gbps of throughput, which is about 3 times faster than Wi-Fi 6.

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