As it became known, Sony will for the first time outsource the production of its CIS (Contact Image Sensor) image sensors to TSMC.
Sony is reportedly planning to use TSMC’s Nanke Fab 14B 40nm process for its 48MP sensor that will appear in the iPhone 14 Pro. In addition, it is planned to use a 28-nanometer process technology in the future. However, the final stage of production of image sensors will still take place at Sony’s own plant in Japan.
As for the change in Sony’s strategy, experts believe that this is mainly due to the desire to meet the huge demand for image sensors for iPhone 14 smartphones. They are expected to receive 48-megapixel cameras, which will be the first major upgrade for Apple in the last seven years. .
The size of a 48-megapixel CIS chip is much larger than that of a 12-megapixel sensor, which means that the need for substrate production capacity will at least double. At the same time, Sony’s own production facilities are clearly not able to meet such a high demand.
Some analysts believe that sales of the iPhone 4 series will be even better than the iPhone 13.