After a lot of warm -ups before, OPPO officially announced the Find X5 series of this year’s flagship mobile phone, and confirmed that it adopts the self-made NPU “MariSilicon X” announced a few days ago.
In terms of appearance, as previously announced, it will continue the hilly main camera module design of the Find X3 series. The Find X5 will use a 6.55-inch, Full HD+ resolution double-sided curved OLED screen, and the Find X5 Pro will use a 6.7-inch, 2K+ The high-resolution AMOLED double-sided curved screen supports LTPO 2.0 technology, which corresponds to a 1Hz-120Hz frame refresh rate and a peak brightness of up to 1300 nits.
Enhance camera performance
Both phones use a 32-megapixel video camera with a hole in the upper left corner, and the Find X5 Pro uses a Sony IMX709 RGBW sensor to enhance the light-in performance when taking selfies .
As for the main camera module, both the wide-angle lens and the ultra-wide-angle lens are equipped with 50 million pixels, Sony IMX766 sensor, and a multi-spectral color sensor with 13-channel design, and a combination of 1 glass and 6 plastic lenses. The difference is that the wide-angle lens of the Find X5 adopts the f/1.8 aperture specification, while the Find X5 Pro adopts the f/1.7 aperture design. In addition, the anti-shake design uses a suspension element to make handheld shooting more stable, and the gyroscope of the body is used for calculation. Vibration amplitude, thereby producing a 5-axis shockproof effect, as for the Find X5, only the general optical shockproof mode is used.
As for the design of the ultra-wide-angle lens, the curved lens is also used to prevent the edge deformation of ultra-wide-angle shooting, while the telephoto lens adopts the 13-megapixel specification and 2x optical zoom specification, and the others use MariSilicon X NPU, ISP and double-layer storage. It supports 20-bit color dynamic range, real-time RAW file processing, RGBW color enhancement, and supports 4K AI HDR low-light environment recording and real-time preview usage modes. The noise reduction effect can be improved by about 20 times compared to Find X3 Pro.
In the cooperation part with Hasselblad, in addition to adopting its technical design in the camera, Hasselblad’s natural color, professional mode and Xpan ultra-wide shooting mode are also added to the shooting mode. Su technical cooperation.
Dimensity 9000 processor version will be exclusive to the Chinese market
In terms of hardware specifications, the Find X5 maintains the Snapdragon 888 processor that Qualcomm launched last year, while the Find X5 Pro uses the Snapdragon 8 Gen 1 processor, and an additional version for the Chinese market that uses the MediaTek Dimensity 9000 processor has become the first in the market. A mobile phone product using this processor.
The Find X5 will be available in blue, black and white, with a glass back design, a 4800mAh battery, support for 80W wired fast charging, and support for 30W wireless fast charging, while the Find X5 Pro is available in a blue leather back version. In addition, black and white ceramic back cover versions are also available. The main camera adopts a more complete integrated design. It also supports 80W wired fast charging, and wireless fast charging is upgraded to 50W specifications. The body also supports IP68 waterproof and dustproof.
The new true wireless headset Enco X2 tuned by the famous music master Joe Hisaishi unveiled
The new true wireless earphone Enco X2 launched with the Find X5 series this time also cooperated with Dynaudio and was tuned by the famous music master Joe Hisaishi.
Enco X2 is designed with a 6mm flat four-magnetic tweeter and a 11mm full-frequency moving coil unit, and uses a diaphragm with a thickness of only 0.0095mm to improve sound quality performance, supports 45dB active noise reduction, and corresponds to Bluetooth 5.2 connection specifications and LHDC 4.0 audio transmission It can also enhance the listening experience through ear canal scanning and hearing compensation. The functional part also supports multi-device pairing, touch operation and panoramic sound recording.