Infinix has announced an innovative cooling technology for smartphones. The process is based on 3D Vapor Cloud Chamber (3D VCC) liquid cooling technology. To increase the volume of the chamber, a unique design has been given on the dimensionality of the shape of the chamber. The new technology improves heating which provides better performance. The new technology has already obtained the certification of the National Intellectual Property Administration of China.
The new Infinix 3D VCC cooling technology will enable smaller panels in the smartphone while improving performance. The new solution addresses temperature issues for high integration and high-powered phones. This will see issues like CPU frequency reduction, frozen screen, frame rate drops, and many more. The new Infinix cooling technology is a major improvement over the regular vapor chamber. Bumps in the system increase evaporter volume, water storage capacity and heat flux. The new technology has improved the efficiency by up to 20 percent.
The 3D VCC has been enhanced due to the bump added to the structure. It reduces thermal resistance and increases thermal conductivity. Shield-to-heat dissipation thermal resistance is also reduced for better heat dissipation. To improve performance, a 3D VCC dissipates heat 12.5 percent faster than a regular VC, so it has a lower temperature. The in-house design of 3D VCC by Infinix is a big deal for OEMs.
Infinix says the new cooling technology will bring slim VCs with more bumps for greater effectiveness. It is also possible to combine 3D VCC with the center frame of the phone in one piece and bring in the entire cooling module. Better smartphones can be made from this, which can also prove to be economical. At this time there is no information about the first devices to have 3D VCC technology.