HUAWEI Aims to Be the First to Introduce HBM Memory into Smartphones
According to Chinese insiders, HUAWEI is preparing a smartphone that supports HBM DRAM—a high-speed memory type typically used in servers and AI accelerators. If confirmed, this move could allow HUAWEI to outpace Apple, which is rumored to adopt similar technology only in 2027, likely for its anniversary iPhone.
Currently, top-tier smartphones use LPDDR5X RAM, while LPDDR6 isn’t expected until the second half of 2026. However, HUAWEI is reportedly planning a more ambitious leap by adopting HBM 3D memory stacking to boost data throughput and reduce power consumption. This shift could be especially impactful for generative AI applications, where current mobile memory solutions are reaching performance limits.
Due to ongoing U.S. sanctions, HUAWEI’s access to cutting-edge chip manufacturing is restricted, and its chips are produced using 7nm technology via China’s SMIC. Despite these limitations, HUAWEI has been pushing forward with innovative engineering approaches. For example, the Mate X5 became the first smartphone to feature a three-layer memory architecture. Now, the potential adoption of HBM memory could mark another major milestone.
The new memory technology is expected to debut in HUAWEI’s upcoming flagship devices, potentially restoring the company’s reputation as a technology trailblazer in the smartphone industry.