Already released chips Apple – M1, M1 Pro and M1 Max – are made on the 5nm process technology of Taiwan’s TSMC. The source claims that Apple and TSMC are planning to produce the second generation processors using an improved version of the 5nm process technology. The chips will likely contain two crystals, allowing for more cores.
In addition, Apple wants to take a very big step forward with the third generation of processors. Some of which will be manufactured using TSMC’s 3nm process technology and have up to four dies, which will accommodate up to 40 cores. For comparison, the M1 is an 8-core processor, while the M1 Pro and M1 Max are 10-core.
The report says TSMC will be able to produce 3nm chips by 2023. Apple’s third-generation processors are codenamed Ibiza, Lobos and Palma, and it is likely that they will first appear in higher-end Mac models.